Technical parameters/power supply voltage (DC): | 3.00V (min) |
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Technical parameters/rise/fall time: | 2.5 ns |
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Technical parameters/number of channels: | 4 |
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Technical parameters/number of pins: | 16 |
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Technical parameters/dissipated power: | 500 mW |
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Technical parameters/rise time: | 2.5 ns |
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Technical parameters/isolation voltage: | 2500 Vrms |
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Technical parameters/input current (Min): | 75 mA |
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Technical parameters/forward voltage (Max): | 5 V |
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Technical parameters/descent time (Max): | 2.5 ns |
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Technical parameters/rise time (Max): | 2.5 ns |
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Technical parameters/operating temperature (Max): | 105 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 500 mW |
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Technical parameters/power supply voltage: | 3V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 3 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Length: | 10.5 mm |
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Dimensions/Width: | 7.6 mm |
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Dimensions/Packaging: | SOIC-16 |
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Physical parameters/operating temperature: | -40℃ ~ 105℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Other/Manufacturing Applications: | Sensing and Instrumentation, Automotive, Industrial, Power Management, Sensing& Instrumentation, Communication and Networking, Industrial, Power Management, Hybrid Electric Vehicles, Communications& Networking |
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Compliant with standards/RoH Alternative material
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