Technical parameters/digits: | 8 |
|
Technical parameters/access time (Max): | 25 ns |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 2.5V ~ 5.5V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | TSSOP-8 |
|
Dimensions/Packaging: | TSSOP-8 |
|
Physical parameters/operating temperature: | -40℃ ~ 85℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | lead-free |
|
Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
23LC1024-I/SN
|
Microchip | 完全替代 | SOIC-8 |
MICROCHIP 23LC1024-I/SN 芯片, 存储器, SRAM, 串行口, 1MB, 2.5V, 8SOIC
|
||
23LCV1024-I/P
|
Microchip | 完全替代 | PDIP-8 |
MICROCHIP 23LCV1024-I/P 芯片, 存储器, SRAM, 串行口, 1MB, 2.5-5.5V, 8PDIP
|
||
23LCV1024-I/ST
|
Microchip | 完全替代 | TSSOP-8 |
MICROCHIP 23LCV1024-I/ST 芯片, 存储器, SRAM, 串行口, 1MB, 2.5-5.5V, 8TSSOP
|
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