Encapsulation parameters/Encapsulation: | HSSOP |
|
Dimensions/Packaging: | HSSOP |
|
Other/Product Lifecycle: | Unknown |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC33887DH
|
NXP | 功能相似 | SOIC-20 |
5A H-Bridge with Load Current Feedback
|
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