Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 16 |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 完全替代 |
24级分频器
|
|||
|
|
Motorola | 完全替代 |
24级分频器
|
|||
MC14521BCPG
|
ON Semiconductor | 完全替代 | DIP-16 |
24级分频器
|
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