Technical parameters/rise/fall time: | 4µs, 3µs |
|
Technical parameters/number of channels: | 1 |
|
Technical parameters/number of pins: | 4 |
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Technical parameters/forward voltage: | 1.2 V |
|
Technical parameters/input current: | 50 mA |
|
Technical parameters/rise time: | 4 µs |
|
Technical parameters/isolation voltage: | 3750 Vrms |
|
Technical parameters/forward current: | 50 mA |
|
Technical parameters/output voltage (Max): | 80 V |
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Technical parameters/input current (Min): | 30 mA |
|
Technical parameters/forward voltage (Max): | 1.4 V |
|
Technical parameters/forward current (Max): | 50 mA |
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Technical parameters/descent time: | 3 µs |
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Technical parameters/dissipated power (Max): | 170 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 4 |
|
Encapsulation parameters/Encapsulation: | 4-Mini-Flat |
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Dimensions/Packaging: | 4-Mini-Flat |
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Physical parameters/operating temperature: | -55℃ ~ 100℃ |
|
Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Signal Processing, Testing and Measurement, Power Management, Computers& Computer Peripherals, Power Management, Test & Measurement, Signal processing, computers and computer peripherals |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
Compliant with standard/REACH SVHC version: | 2015/12/17 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCPL-181-00DE
|
Broadcom | 功能相似 | 4-Mini-Flat |
HCPL-181-00DE 编带
|
||
HCPL-181-00DE
|
AVAGO Technologies | 功能相似 | SOIC-4 |
HCPL-181-00DE 编带
|
||
HCPL-181-060E
|
Agilent | 类似代替 |
BROADCOM LIMITED HCPL-181-060E 光电耦合器, 晶体管输出, 1通道, SOP, 4 引脚, 50 mA, 3.75 kV, 50 %
|
|||
HCPL-181-06DE
|
AVAGO Technologies | 类似代替 | Mini-Flat |
BROADCOM LIMITED HCPL-181-06DE 光电耦合器, 晶体管输出, 1通道, SOIC, 4 引脚, 50 mA, 3.75 kV, 300 %
|
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