Technical parameters/Contact electroplating: | Gold |
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Technical parameters/rated voltage (DC): | 110 V |
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Technical parameters/rated voltage (AC): | 250 V |
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Technical parameters/rated current: | 5 A |
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Technical parameters/contact type: | SPST |
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Technical parameters/Contact resistance: | 30 mΩ |
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Technical parameters/power consumption: | 180 mW |
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Technical parameters/Contact rated current: | 5 A |
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Technical parameters/coil voltage: | 24 VDC |
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Technical parameters/coil current: | 7.5 mA |
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Technical parameters/coil power (DC): | 180 mW |
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Technical parameters/coil resistance: | 3.2 kΩ |
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Technical parameters/rated current (Max): | 5 A |
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Technical parameters/coil voltage (DC): | 24 V |
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Technical parameters/coil power: | 180 mW |
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Technical parameters/rated power (Max): | 150W, 1.25KVA |
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Technical parameters/Switching current (Max): | 5 A |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 4 |
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Encapsulation parameters/Encapsulation: | SIP |
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Dimensions/Length: | 21 mm |
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Dimensions/Width: | 5 mm |
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Dimensions/Height: | 12.8 mm |
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Dimensions/Packaging: | SIP |
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Physical parameters/contact material: | Silver Nickel |
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Physical parameters/operating temperature: | -40℃ ~ 70℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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