Technical parameters/RAM size: | 12 KB |
|
Technical parameters/dissipated power: | 800 mW |
|
Technical parameters/Analog to Digital Conversion (ADC): | 1 |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 800 mW |
|
Package parameters/number of pins: | 64 |
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Encapsulation parameters/Encapsulation: | QFP |
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Dimensions/Packaging: | QFP |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
|
Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MB96F356RSBPMC1-GSE2
|
Cypress Semiconductor | 类似代替 | QFP |
MCU 16Bit F2MC 16FX RISC 288KB Flash 3.3V/5V 64Pin LQFP
|
||
MB96F356RSBPMC1-GSE2
|
Fujitsu | 类似代替 | LQFP |
MCU 16Bit F2MC 16FX RISC 288KB Flash 3.3V/5V 64Pin LQFP
|
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