Package parameters/number of pins: | 20 |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC374APW,112
|
NXP | 完全替代 | TSSOP-20 |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1Element 20Pin TSSOP Bulk
|
||
|
|
NXP | 完全替代 | TSSOP-20 |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1Element 20Pin TSSOP T/R
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review