Technical parameters/dissipated power: | 500 mW |
|
Technical parameters/operating temperature (Max): | 125 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Technical parameters/power supply voltage: | 2V ~ 6V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOIC-16 |
|
Dimensions/Packaging: | SOIC-16 |
|
Physical parameters/operating temperature: | -40℃ ~ 125℃ (TA) |
|
Other/Product Lifecycle: | New Product |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | lead-free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC123D,653
|
Nexperia | 功能相似 | SOIC-16 |
NXP 74HC123D,653 芯片, 多谐振荡器, 74HC123, 16SOIC
|
||
74HC123D,653
|
NXP | 功能相似 | SOIC-16 |
NXP 74HC123D,653 芯片, 多谐振荡器, 74HC123, 16SOIC
|
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