Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOP |
|
Dimensions/Packaging: | SOP |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Bulk |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX653CSA+T
|
Maxim Integrated | 功能相似 | SOIC-8 |
降压型 Vin=4V~11.5V 225mA
|
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