Package parameters/number of pins: | 6 |
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Encapsulation parameters/Encapsulation: | HVSON |
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Dimensions/Packaging: | HVSON |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR) |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Maxim Integrated | 功能相似 | HVSON |
Power Supply Support Circuit, Adjustable, 1 Channel, BICMOS, 3 X 3 MM, 0.80 MM HEIGHT, MO-229, TDFN-6
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