Technical parameters/power supply voltage (DC): | 3.00V (min) |
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Technical parameters/power supply current: | 16 mA |
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Technical parameters/number of pins: | 8 |
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Technical parameters/dissipated power: | 94 mW |
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Technical parameters/Input voltage (Max): | 2 V |
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Technical parameters/input voltage (Min): | 0.8 V |
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Technical parameters/output voltage (Max): | 650 mV |
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Technical parameters/input current (Min): | 32 μA |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 94 mW |
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Technical parameters/power supply voltage: | 3.3 V |
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Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 3 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4 mm |
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Dimensions/Height: | 1.5 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Each |
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Other/Manufacturing Applications: | Communications & Networking, Clock & Timing, Communication and Networks, Clocks and Timing |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Compliant with standard/REACH SVHC version: | <
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ADN4694EBRZ-RL7
|
ADI | 完全替代 | SOIC-8 |
LVDS 接口集成电路 MLVDS Xcvr,HD,100M Type 2 Rx,EnhancedESD
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