Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | SOIC |
|
Dimensions/Packaging: | SOIC |
|
Other/Product Lifecycle: | Unknown |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS1307ZN+
|
Dallas Semiconductor | 功能相似 | SOIC |
MAXIM INTEGRATED PRODUCTS DS1307ZN+ 芯片, 实时时钟 串口 64X8
|
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