Encapsulation parameters/Encapsulation: | DIP |
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Dimensions/Packaging: | DIP |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Bulk |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX333CWP+
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Maxim Integrated | 功能相似 | SOIC-20 |
MAXIM INTEGRATED PRODUCTS MAX333CWP+ 模拟开关, CMOS, SPDT, 4 放大器, 350 ohm, 10V至30V, ± 5V至± 18V, WSOIC, 20 引脚
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