Package parameters/number of pins: | 6 |
|
Encapsulation parameters/Encapsulation: | TSOP |
|
Dimensions/Packaging: | TSOP |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC1G3157GW,125
|
Nexperia | 功能相似 | SC-88-6 |
NXP 74LVC1G3157GW,125 芯片, 模拟多路复用器/信号分离器, 2通道, SOT363-6
|
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