Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | HVQCCN |
|
Dimensions/Packaging: | HVQCCN |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX1585ETJ+T
|
Maxim Integrated | 功能相似 | TQFN-32 |
Conv DC-DC Quint Non-Inv/Inv/Step Up/Step Down 0.7V to 5.5V 32Pin TQFN EP T/R
|
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