Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | TSSOP |
|
Dimensions/Packaging: | TSSOP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVT16373ADGG,112
|
NXP | 功能相似 | TSSOP-48 |
NXP 74LVT16373ADGG,112 芯片, 锁存器, D型, 透明, 三态, TSSOP-48
|
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