Encapsulation parameters/installation method: | Through Hole |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Vishay Semiconductor | 功能相似 | Through Hole |
Cap Alum 33uF 20% 400V Radial
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|
|
Vishay Roederstein | 功能相似 | Through Hole |
Cap Alum 33uF 20% 400V Radial
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||
UCA2G330MHD1TN
|
Nichicon | 功能相似 | Radial, Can |
铝电解电容器 - 径向引线型 33uF 400 Volts 20%
|
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