Technical parameters/number of contacts: | 6 |
|
Technical parameters/Contact electroplating: | Gold |
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Technical parameters/rated current: | 500 mA |
|
Technical parameters/Insulation resistance: | 100 MΩ |
|
Technical parameters/number of rows: | 1 |
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Technical parameters/halogen-free state: | Not Low Halogen |
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Technical parameters/number of circuits: | 6 |
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Technical parameters/number of plug and unplug cycles: | 5000 |
|
Technical parameters/rated current (Max): | 0.5A/contact |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -30 ℃ |
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Technical parameters/rated voltage (Max): | 50 VDC |
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Technical parameters/Contact resistance (Max): | 100 mΩ |
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Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | SMD |
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Dimensions/Length: | 19.35 mm |
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Dimensions/Width: | 26.3 mm |
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Dimensions/Height: | 1.8 mm |
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Dimensions/Packaging: | SMD |
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Physical parameters/contact material: | Copper Alloy |
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Physical parameters/materials: | Thermoplastic |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Consumer Electronics |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Customs information/ECCN code: | EAR99 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SIMMP-P0605BTR2-0
|
Multicomp | 类似代替 |
MULTICOMP SIMMP-P0605BTR2-0 存储器插槽, SIM插座, 6 触点, 铜, 镀金触芯
|
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