Encapsulation parameters/installation method: | Through Hole |
|
Package parameters/number of pins: | 18 |
|
Encapsulation parameters/Encapsulation: | DIP-18 |
|
Dimensions/Packaging: | DIP-18 |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
UTC | 功能相似 | DIP-18 |
音频放大器 PA1517G DIP-18
|
||
TDA1517P/N3,112
|
NXP | 功能相似 | DIP-18 |
TDA1517P/N3,112 管装
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review