Technical parameters/Contact electroplating: | Tin over Copper, Tin |
|
Technical parameters/Insulation resistance: | 10000 MΩ |
|
Technical parameters/direction: | Straight |
|
Encapsulation parameters/installation method: | Through Hole |
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Encapsulation parameters/Encapsulation: | - |
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Dimensions/Length: | 14.02 mm |
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Dimensions/Width: | 6.35 mm |
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Dimensions/Packaging: | - |
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Dimensions/Thickness: | 0.8 mm |
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Physical parameters/color: | Silver |
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Physical parameters/contact material: | Brass |
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Physical parameters/materials: | Brass |
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Physical parameters/insulation material: | Non-Insulated |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: | Industrial, Industrial |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with standards/ELV standards: | Compliant |
|
Customs information/ECCN code: | EAR99 |
|
Customs information/HTS code: | 8536904000 |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
19705-4301
|
Molex | 功能相似 |
MOLEX 19705-4301. 接线端子, 插片式, 公, 0.25英寸, 通孔
|
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