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Model GRM21BR61E475MA12L

Description MURATA GRM21BR61E475MA12L Multilayer ceramic capacitor, surface mount, GRM series, 4.7 µ F, ± 20%, X5R, 25 V, 0805 [2012 metric]

Brand: muRata

Packaging 0805

Delivery time

Packaging method Cut Tape (CT)

Standard packaging quantity 1

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Technical parameters/rated voltage (DC):	25.0 V
Technical parameters/capacitance:	4.7 µF
Technical parameters/tolerances:	±20 %
Technical parameters/dielectric properties:	X5R
Technical parameters/product series:	GRM
Technical parameters/operating temperature (Max):	85 ℃
Technical parameters/operating temperature (Min):	-55 ℃
Technical parameters/rated voltage:	25 V
Encapsulation parameters/installation method:	Surface Mount
Encapsulation parameters/Encapsulation (metric):	2012
Encapsulation parameters/Encapsulation:	0805
Dimensions/Length:	2 mm
Dimensions/Width:	1.25 mm
Dimensions/Height:	1.25 mm
Dimensions/Packaging (Metric):	2012
Dimensions/Packaging:	0805
Dimensions/Thickness:	1.25 mm
Physical parameters/materials:	X5R/-55℃~+85℃
Physical parameters/operating temperature:	-55℃ ~ 85℃
Physical parameters/temperature coefficient:	±15 %
Other/Product Lifecycle:	Active
Other/Packaging Methods:	Cut Tape (CT)
Other/Minimum Packaging:	3000
Other/Manufacturing Applications:	Industrial, General, Portable Devices, Power Management, Portable Equipment, Power Management, Consumer Electronics,
Compliant with standards/RoHS standards:	RoHS Compliant
Compliant with standards/lead standards:	Lead Free
Compliant with the REACH SVHC standard:	No SVHC
Compliant with standard/REACH SVHC version:	2015/12/17

Alternative material

	Model	Brand	Similarity	Encapsulation	Introduction	Data manual
	GRM21BR61E475KA12K	muRata	类似代替	0805	Murata GRM 0805 X5R、X7R 和 Y5V 电介质 Murata GRM 系列高介电常数类型尺寸小，电容值大，采用多层结构高可靠性，无极性通过在外部电极镀锡实现出色的可焊接性去耦平滑电路和高于 200V 额定电压的钳减震器电路中的应用 ### 0805 系列镍挡板终端覆镀锡 (NiSn) 层，应用包括移动电话、视频和调谐器设计，COG/NPO 是温度补偿的最常见配方，为 EIA I 类陶瓷材料，X7R、X5R 配方称为温度稳定陶瓷，属于 EIA II 类材料，Y5V、Z5U 配方适合有限温度范围内的一般用途，属于 EIA II 类材料；这些特征非常适合退耦应用。Y5V、Z5U 配方适合有限温度范围内的一般用途，属于 EIA II 类材料；这些特征非常适合退耦应用。	PDF