Technical parameters/power supply voltage (DC): | 3.30 V |
|
Technical parameters/output voltage: | 600 mV |
|
Technical parameters/output current: | 10.0 µA |
|
Technical parameters/power supply current: | 800 µA |
|
Technical parameters/digits: | 11 |
|
Technical parameters/Static current: | 1.70 mA |
|
Technical parameters/accuracy: | ±3℃ (Max) |
|
Technical parameters/power supply voltage: | 3V ~ 3.6V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 8 |
|
Encapsulation parameters/Encapsulation: | TSSOP-8 |
|
Dimensions/Packaging: | TSSOP-8 |
|
Physical parameters/operating temperature: | 0℃ ~ 125℃ |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM99-1CIMM/NOPB
|
National Semiconductor | 完全替代 |
采用 TruTherm 技术且具有 SMBus 接口的远程和本地温度传感器 8-VSSOP 0 to 85
|
|||
LM99-1CIMM/NOPB
|
TI | 完全替代 | VSSOP-8 |
采用 TruTherm 技术且具有 SMBus 接口的远程和本地温度传感器 8-VSSOP 0 to 85
|
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