Technical parameters/number of contacts: | 2 |
|
Technical parameters/Contact electroplating: | Tin |
|
Technical parameters/rated current: | 3 A |
|
Technical parameters/Insulation resistance: | >1000 MΩ |
|
Technical parameters/number of rows: | 1 |
|
Technical parameters/number of pins: | 2 |
|
Technical parameters/rated current (Max): | 3 A |
|
Technical parameters/rated voltage: | 250 V |
|
Technical parameters/Contact resistance (Max): | 20 mΩ |
|
Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | straight pin |
|
Packaging parameters/pin spacing: | 2.00 mm |
|
Dimensions/Length: | 6 mm |
|
Dimensions/Width: | 5.3 mm |
|
Dimensions/Height: | 7.7 mm |
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Dimensions/Packaging: | straight pin |
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Dimensions/Pin Spacing: | 2.00 mm |
|
Physical parameters/shell color: | White |
|
Physical parameters/color: | Natural |
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Physical parameters/contact material: | Copper Alloy |
|
Physical parameters/operating temperature: | -25℃ ~ 85℃ |
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Physical parameters/shell material: | Nylon |
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Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Other/Manufacturing Applications: | - |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
B02B-PASK-1
|
JST | 功能相似 | Through Hole |
JST (JAPAN SOLDERLESS TERMINALS) B02B-PASK-1 线至板连接器, 顶部进入, PA系列, 2 触点, 针座, 2 mm, 通孔安装, 1 排
|
||
B02B-PASK-1
|
JST | 功能相似 |
JST (JAPAN SOLDERLESS TERMINALS) B02B-PASK-1 线至板连接器, 顶部进入, PA系列, 2 触点, 针座, 2 mm, 通孔安装, 1 排
|
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