Technical parameters/number of channels: | 2 |
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Technical parameters/number of pins: | 8 |
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Technical parameters/forward voltage: | 1.5 V |
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Technical parameters/input current: | 20 mA |
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Technical parameters/dissipated power: | 135 mW |
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Technical parameters/isolation voltage: | 3.75 kV |
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Technical parameters/forward current: | 20 mA |
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Technical parameters/output voltage (Max): | 7 V |
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Technical parameters/forward voltage (Max): | 1.7 V |
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Technical parameters/forward current (Max): | 20 mA |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | 0 ℃ |
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Technical parameters/dissipated power (Max): | 135 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Height: | 3.18 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Each |
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Other/Manufacturing Applications: | Signal Processing, Communications & Networking, Signal Processing, Communications& Networking, Signal Processing, Communication and Network |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | PB free |
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Compliant with standard/REACH SVHC version: | 2015/12/17 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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