Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | TSOP-32 |
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Dimensions/Packaging: | TSOP-32 |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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ST Microelectronics | 类似代替 | TSOP-32 |
8兆位( 13× 64K字节块+ 3 ×16× 4K字节扇区) , 3V供应固件集线器/低引脚数闪存 8 Mbit (13 x 64KByte Blocks + 3 x 16 x 4KByte Sectors), 3V Supply Firmware Hub / Low Pin Count Flash Memory
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Micron | 功能相似 |
8兆位( 13× 64K字节块+ 3 ×16× 4K字节扇区) , 3V供应固件集线器/低引脚数闪存 8 Mbit (13 x 64KByte Blocks + 3 x 16 x 4KByte Sectors), 3V Supply Firmware Hub / Low Pin Count Flash Memory
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M50FLW080ANB5TG
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ST Microelectronics | 功能相似 | TSOP-32 |
8兆位( 13× 64K字节块+ 3 ×16× 4K字节扇区) , 3V供应固件集线器/低引脚数闪存 8 Mbit (13 x 64KByte Blocks + 3 x 16 x 4KByte Sectors), 3V Supply Firmware Hub / Low Pin Count Flash Memory
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M50FW080NB5G
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ST Microelectronics | 完全替代 | TSOP1 |
8兆位1Mb的X8 ,统一座3V供应固件集线器闪存 8 Mbit 1Mb x8, Uniform Block 3V Supply Firmware Hub Flash Memory
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