Technical parameters/power supply voltage (DC): | 5.00 V, 5.50 V (max) |
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Technical parameters/operating voltage: | 4.75V ~ 5.5V |
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Technical parameters/capacitance: | 10 pF |
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Technical parameters/power supply current: | 80 mA |
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Technical parameters/number of pins: | 24 |
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Technical parameters/clock frequency: | 70.0 GHz |
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Technical parameters/dissipated power: | 1000 mW |
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Technical parameters/access time: | 70 ns |
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Technical parameters/memory capacity: | 16000000 B |
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Technical parameters/access time (Max): | 70 ns |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | 0 ℃ |
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Technical parameters/dissipated power (Max): | 1000 mW |
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Technical parameters/power supply voltage: | 4.75V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 4.75 V |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 24 |
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Encapsulation parameters/Encapsulation: | DIP-24 |
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Dimensions/Length: | 34.8 mm |
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Dimensions/Width: | 18.34 mm |
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Dimensions/Height: | 8.89 mm |
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Dimensions/Packaging: | DIP-24 |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tube |
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Other/Manufacturing Applications: | Security, safety |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with t Alternative material
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