Technical parameters/Input voltage (DC): | 1.50 V |
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Technical parameters/output voltage: | 30.0 V |
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Technical parameters/number of channels: | 1 |
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Technical parameters/forward voltage: | 1.8 V |
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Technical parameters/input current: | 20.0 mA |
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Technical parameters/dissipated power: | 145 mW |
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Technical parameters/data rate: | 1.00 Mbps |
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Technical parameters/isolation voltage: | 3750 Vrms |
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Technical parameters/forward current: | 20 mA |
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Technical parameters/forward voltage (Max): | 1.8 V |
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Technical parameters/forward current (Max): | 25 mA |
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Technical parameters/operating temperature (Max): | 100 ℃ |
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Technical parameters/operating temperature (Min): | 40 ℃ |
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Technical parameters/dissipated power (Max): | 145 mW |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 5 |
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Encapsulation parameters/Encapsulation: | SOIC |
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Dimensions/Length: | 3.6 mm |
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Dimensions/Width: | 4.4 mm |
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Dimensions/Height: | 2.5 mm |
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Dimensions/Packaging: | SOIC |
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Physical parameters/operating temperature: | -40℃ ~ 100℃ |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tube |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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