Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | TSSOP |
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Dimensions/Packaging: | TSSOP |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Burr Brown | 功能相似 | SOP |
DUAL OP-AMP, 125uV OFFSET-MAX, 0.1MHz BAND WIDTH, PDSO8, GREEN, PLASTIC, MSOP-8
|
||
|
|
TI | 功能相似 | TSSOP |
DUAL OP-AMP, 125uV OFFSET-MAX, 0.1MHz BAND WIDTH, PDSO8, GREEN, PLASTIC, MSOP-8
|
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