Technical parameters/frequency: | 1 MHz |
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Technical parameters/power supply voltage (DC): | 4.50V (min) |
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Technical parameters/rise/fall time: | 25ns, 10ns (Max) |
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Technical parameters/number of output interfaces: | 2 |
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Technical parameters/output current: | 10 mA |
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Technical parameters/power supply current: | 200 mA |
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Technical parameters/number of channels: | 2 |
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Technical parameters/number of pins: | 16 |
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Technical parameters/dissipated power: | 150 mW |
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Technical parameters/rise time: | 25 ns |
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Technical parameters/isolation voltage: | 2500 Vrms |
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Technical parameters/input current (Min): | 10 μA |
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Technical parameters/forward voltage (Max): | 5.5 V |
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Technical parameters/descent time: | 10 ns |
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Technical parameters/descent time (Max): | 10 ns |
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Technical parameters/rise time (Max): | 25 ns |
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Technical parameters/operating temperature (Max): | 105 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/power supply voltage: | 4.5V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 4.5 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Length: | 10.5 mm |
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Dimensions/Width: | 7.6 mm |
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Dimensions/Packaging: | SOIC-16 |
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Physical parameters/operating temperature: | -40℃ ~ 105℃ |
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Other/Product Lifecycle: | Active |
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