Encapsulation parameters/Encapsulation: | HLSOP |
|
Dimensions/Packaging: | HLSOP |
|
Other/Product Lifecycle: | Unknown |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
National | 类似代替 |
Conv DC-DC 4.5V to 42V Step Down Single-Out 1.285V 3A 8Pin HSOP EP Rail
|
|||
LM22676MR-ADJ
|
TI | 类似代替 | HSOP |
Conv DC-DC 4.5V to 42V Step Down Single-Out 1.285V 3A 8Pin HSOP EP Rail
|
||
LM22676MRE-5.0
|
National Semiconductor | 类似代替 | SOIC8 |
TEXAS INSTRUMENTS LM22676MRE-5.0 芯片, 稳压器, 3.0A 4.5~42Vin, 8PSOP
|
||
LM22676MRE-5.0
|
National Semiconductor | 类似代替 | SOIC8 |
TEXAS INSTRUMENTS LM22676MRE-5.0 芯片, 稳压器, 3.0A 4.5~42Vin, 8PSOP
|
||
|
|
National | 完全替代 |
Conv DC-DC 4.5V to 42V Step Down Single-Out 5V 3A 8Pin HSOP EP T/R
|
|||
|
|
National | 功能相似 |
DC-DC芯片/LM22676MRX-ADJ
|
|||
LM22676MRX-ADJ
|
National Semiconductor | 功能相似 | SOIC8 |
DC-DC芯片/LM22676MRX-ADJ
|
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