Technical parameters/frequency: | 402 MHz |
|
Technical parameters/RAM size: | 423936 b |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Technical parameters/power supply voltage: | 1.15V ~ 1.25V |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 256 |
|
Encapsulation parameters/Encapsulation: | FBGA-256 |
|
Dimensions/Height: | 1.05 mm |
|
Dimensions/Packaging: | FBGA-256 |
|
Physical parameters/operating temperature: | 0℃ ~ 85℃ |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tray |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
Customs information/ECCN code: | EAR99 |
|
Customs Information/Hong Kong Import and Export License: | NLR |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | BGA-256 |
FPGA Cyclone® III Family 5136 Cells 500MHz 65nm Technology 1.2V 256Pin TFBGA
|
||
EP3C5F256C6
|
Altera | 完全替代 | FBGA-256 |
FPGA Cyclone® III Family 5136 Cells 500MHz 65nm Technology 1.2V 256Pin TFBGA
|
||
|
|
Intel | 类似代替 | FBGA-256 |
IC FPGA 182 I/O 256FBGA
|
||
EP3C5F256I7
|
Intel | 类似代替 | FBGA-256 |
IC FPGA 182 I/O 256FBGA
|
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