Encapsulation parameters/Encapsulation: | SOIC-8 |
|
Dimensions/Packaging: | SOIC-8 |
|
Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMH6643MAX
|
National Semiconductor | 功能相似 | SOIC-8 |
3V ,低功耗,为130MHz , 75毫安轨到轨输出放大器 3V, Low Power, 130MHz, 75mA Rail-to-Rail Output Amplifiers
|
||
LMH6643MAX
|
TI | 功能相似 | SOIC-8 |
3V ,低功耗,为130MHz , 75毫安轨到轨输出放大器 3V, Low Power, 130MHz, 75mA Rail-to-Rail Output Amplifiers
|
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