Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | Axial |
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Dimensions/Packaging: | Axial |
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Physical parameters/medium materials: | Tantalum |
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Other/Product Lifecycle: | Active |
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Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Vishay Semiconductor | 功能相似 | Through Hole |
22uF ±10% 50V Φ8.92mm 19.96mm
|
||
|
|
KEMET Corporation | 功能相似 |
22uF ±10% 50V Φ8.92mm 19.96mm
|
|||
|
|
Vishay Sprague | 功能相似 | Axial |
22uF ±10% 50V Φ8.92mm 19.96mm
|
||
|
|
VISHAY | 功能相似 | Axial |
22uF ±10% 50V Φ8.92mm 19.96mm
|
||
|
|
Vishay Sprague | 功能相似 |
22uF ±10% 50V Φ8.92mm 23.42mm
|
|||
M39003/09-2084
|
KEMET Corporation | 功能相似 | Axial |
22uF ±10% 50V Φ8.92mm 23.42mm
|
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