Encapsulation parameters/installation method: | Through Hole |
|
Physical parameters/medium materials: | Tantalum |
|
Other/Product Lifecycle: | Active |
|
Other/Packaging Methods: | Bulk |
|
Compliant with standards/RoHS standards: | Non-Compliant |
|
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M39003/09-0182
|
KEMET Corporation | 功能相似 | Axial |
18uF ±10% 50V Φ7.34mm 20.88mm
|
||
M39003/09-0282
|
KEMET Corporation | 功能相似 | Through Hole |
18uF ±10% 50V Φ7.34mm 17.42mm
|
||
M39003/09-2082
|
VISHAY | 功能相似 | Axial |
18uF ±10% 50V Φ7.34mm 17.42mm
|
||
M39003/09-2082
|
Vishay Semiconductor | 功能相似 | Through Hole |
18uF ±10% 50V Φ7.34mm 17.42mm
|
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