Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | Axial |
|
Dimensions/Packaging: | Axial |
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Other/Product Lifecycle: | Active |
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Compliant with standards/RoHS standards: | Non-Compliant |
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Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Vishay Semiconductor | 完全替代 | Through Hole |
150uF ±10% 15V Φ7.34mm 17.42mm
|
||
|
|
Vishay Sprague | 功能相似 |
Cap Tant Solid 150uF 15V 10% (7.34 X 17.42mm) Axial (0.01%FR)
|
|||
|
|
KEMET Corporation | 功能相似 |
Cap Tant Solid 150uF 15V 10% (7.34 X 17.42mm) Axial (0.01%FR)
|
|||
|
|
Vishay Semiconductor | 功能相似 | Through Hole |
Cap Tant Solid 150uF 15V 10% (7.34 X 17.42mm) Axial (0.01%FR)
|
||
|
|
VISHAY | 功能相似 | Axial |
150uF ±10% 15V Φ7.34mm 17.42mm
|
||
|
|
KEMET Corporation | 功能相似 |
150uF ±10% 15V Φ7.34mm 17.42mm
|
|||
|
|
Vishay Sprague | 功能相似 | Axial |
150uF ±10% 15V Φ7.34mm 17.42mm
|
||
M39003/03-2038
|
Vishay Semiconductor | 功能相似 |
150uF ±10% 15V Φ7.34mm 17.42mm
|
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