Technical parameters/RAM size: | 56320 b |
|
Technical parameters/operating temperature (Max): | 85 ℃ |
|
Technical parameters/operating temperature (Min): | 0 ℃ |
|
Technical parameters/power supply voltage: | 1.14V ~ 1.26V |
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Technical parameters/power supply voltage (Max): | 1.26 V |
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Technical parameters/power supply voltage (Min): | 1.14 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 256 |
|
Encapsulation parameters/Encapsulation: | FPBGA-256 |
|
Dimensions/Length: | 17 mm |
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Dimensions/Width: | 17 mm |
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Dimensions/Height: | 1.2 mm |
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Dimensions/Packaging: | FPBGA-256 |
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Physical parameters/operating temperature: | 0℃ ~ 85℃ (TJ) |
|
Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
|
Customs Information/Hong Kong Import and Export License: | NLR |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LFE2-6E-6FN256C
|
Lattice Semiconductor | 完全替代 | BGA-256 |
Field Programmable Gate Array, 357MHz, 6000-Cell, PBGA256, 17 X 17MM, LEAD FREE, FPBGA-256
|
||
LFE2-6SE-5FN256C
|
Lattice Semiconductor | 完全替代 | BGA-256 |
Field Programmable Gate Array, 311MHz, 6000-Cell, PBGA256, 17 X 17MM, LEAD FREE, FPBGA-256
|
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