Technical parameters/operating temperature (Max): | 100 ℃ |
|
Technical parameters/operating temperature (Min): | -40 ℃ |
|
Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 256 |
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Encapsulation parameters/Encapsulation: | BGA-256 |
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Dimensions/Packaging: | BGA-256 |
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Physical parameters/operating temperature: | -40℃ ~ 100℃ (TJ) |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EPM2210F256C3N
|
Altera | 类似代替 | FBGA-256 |
Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17MM, 1MM PITCH, LEAD FREE, FBGA-256
|
||
|
|
Intel | 完全替代 | FBGA-256 |
CPLD MAX® II Family 1700 Macro Cells 201.1MHz 0.18um Technology 2.5V/3.3V 256-Pin FBGA Tray
|
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