Technical parameters/power supply voltage (DC): | 2.70V (min) |
|
Technical parameters/operating voltage: | 2.7V ~ 5.5V |
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Technical parameters/number of pins: | 32 |
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Technical parameters/access time: | 55 ns |
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Technical parameters/memory capacity: | 500000 B |
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Technical parameters/operating temperature (Max): | 70 ℃ |
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Technical parameters/operating temperature (Min): | 0 ℃ |
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Technical parameters/power supply voltage: | 2.7V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 2.7 V |
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Encapsulation parameters/installation method: | Through Hole |
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Package parameters/number of pins: | 32 |
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Encapsulation parameters/Encapsulation: | DIP-32 |
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Dimensions/Length: | 41.91 mm |
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Dimensions/Width: | 13.818 mm |
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Dimensions/Height: | 3.81 mm |
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Dimensions/Packaging: | DIP-32 |
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Physical parameters/operating temperature: | 0℃ ~ 70℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Each |
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Other/Manufacturing Applications: | Embedded Design & Development, Embedded Design and Development |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: | No SVHC |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AS7C1024C-12JIN
|
Alliance Memory | 功能相似 | SOJ-32 |
RAM，Alliance Memory ### SRAM（静态随机存取存储器）
|
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