Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | MLF-16 |
|
Dimensions/Packaging: | MLF-16 |
|
Other/Packaging Methods: | Tape & Reel (TR) |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SY89872UMG
|
Micrel | 完全替代 | MLF-16 |
MICROCHIP SY89872UMG 芯片, 时钟驱动器/扇出缓冲器, LVDS, 16MLF
|
||
SY89872UMI-TR
|
Microchip | 完全替代 | VFQFN-16 |
IC CLK BUFFER 1:3 2GHz 16MLF
|
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