Technical parameters/frequency: | 32 MHz |
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Technical parameters/power supply voltage (DC): | 1.80V (min) |
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Technical parameters/number of pins: | 64 |
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Technical parameters/clock frequency: | 32.0 MHz |
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Technical parameters/RAM size: | 16 KB |
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Technical parameters/digits: | 32 |
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Technical parameters/dissipated power: | 444 mW |
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Technical parameters/FLASH memory capacity: | 256 KB |
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Technical parameters/Analog to Digital Conversion (ADC): | 1 |
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Technical parameters/number of inputs/outputs: | 51 Input |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 444 mW |
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Technical parameters/Digital to Analog Conversion (DAC): | 2 |
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Technical parameters/power supply voltage: | 1.8V ~ 3.6V |
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Technical parameters/power supply voltage (Max): | 3.6 V |
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Technical parameters/power supply voltage (Min): | 1.8 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 64 |
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Encapsulation parameters/Encapsulation: | LQFP-64 |
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Dimensions/Length: | 10.2 mm |
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Dimensions/Width: | 10.2 mm |
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Dimensions/Height: | 1.45 mm |
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Dimensions/Packaging: | LQFP-64 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Other/Manufacturing Applications: | Computers and computer peripherals, signal processing, Embedded Design& Development, Signal Processing, Computers & Computer Peripherals, Embedded Design&Development; Developmen Alternative material
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