Technical parameters/power supply voltage (DC): | 2.50V (min) |
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Technical parameters/rise/fall time: | 2.5 ns |
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Technical parameters/number of channels: | 4 |
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Technical parameters/number of pins: | 16 |
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Technical parameters/dissipated power: | 275 mW |
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Technical parameters/data rate: | 150 Mbps |
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Technical parameters/rise time: | 4 ns |
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Technical parameters/isolation voltage: | 5000 Vrms |
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Technical parameters/input current (Min): | 7.8 mA |
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Technical parameters/forward voltage (Max): | 5.5 V |
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Technical parameters/descent time (Max): | 4 ns |
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Technical parameters/rise time (Max): | 4 ns |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 275 mW |
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Technical parameters/power supply voltage: | 2.5V ~ 5.5V |
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Technical parameters/power supply voltage (Max): | 5.5 V |
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Technical parameters/power supply voltage (Min): | 2.5 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 16 |
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Encapsulation parameters/Encapsulation: | SOIC-16 |
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Dimensions/Length: | 10.3 mm |
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Dimensions/Width: | 7.5 mm |
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Dimensions/Packaging: | SOIC-16 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Cut Tape (CT) |
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Other/Manufacturing Applications: | Industrial, Automotive, Communication and Network, Industrial, Medical, Automation and Process Control, Medical, Automation& Process Control, Motor Drive&Control, Automotive, Mo Alternative material
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