Encapsulation parameters/installation method: | Surface Mount |
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Encapsulation parameters/Encapsulation: | BGA |
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Dimensions/Packaging: | BGA |
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Other/Product Lifecycle: | Unknown |
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Other/Packaging Methods: | Tray |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Customs information/ECCN code: | EAR99 |
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| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Integrated Device Technology | 功能相似 | BGA |
21 ( +1 )通道高密度T1 / E1 / J1线路接口单元 21(+1) Channel High-Density T1/E1/J1 Line Interface Unit
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