Technical parameters/capacitance: | 0.33 µF |
|
Encapsulation parameters/installation method: | Through Hole |
|
Encapsulation parameters/Encapsulation: | N/R |
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Dimensions/Packaging: | N/R |
|
Physical parameters/medium materials: | Tantalum |
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Physical parameters/operating temperature: | -55℃ ~ 125℃ |
|
Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Bulk |
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Compliant with standards/RoHS standards: |
| |
Compliant with standards/lead standards: | Contains Lead |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
KEMET Corporation | 完全替代 | Through Hole |
Cap Tant Solid 0.33uF 50V 10% (3.43 X 7.26mm) Axial (0.01%FR) 125℃ Bulk
|
||
|
|
KEMET Corporation | 完全替代 |
Cap Tant Solid 0.33uF 50V 10% (3.43 X 7.26mm) Axial (0.01%FR)
|
|||
M39003/01-7179
|
Vishay Semiconductor | 完全替代 | Through Hole |
Cap Tant Solid 0.33uF 50V 10% (3.43 X 7.26mm) Axial (0.01%FR)
|
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