Technical parameters/number of output interfaces: | 2 |
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Technical parameters/power supply current: | 56 mA |
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Technical parameters/number of channels: | 2 |
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Technical parameters/number of pins: | 72 |
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Technical parameters/digits: | 16 |
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Technical parameters/dissipated power: | 0.355 W |
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Technical parameters/sampling rate: | 250 Msps |
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Technical parameters/resolution (Bits): | 16.0 |
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Technical parameters/operating temperature (Max): | 85 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 355 mW |
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Technical parameters/Digital to Analog Conversion (DAC): | 2 |
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Technical parameters/power supply voltage (Max): | 3.47 V |
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Technical parameters/power supply voltage (Min): | 3.13 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 72 |
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Encapsulation parameters/Encapsulation: | LFCSP-72 |
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Dimensions/Length: | 10 mm |
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Dimensions/Width: | 10 mm |
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Dimensions/Height: | 0.8 mm |
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Dimensions/Packaging: | LFCSP-72 |
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Physical parameters/operating temperature: | -40℃ ~ 85℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tray |
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Other/Manufacturing Applications: | RF Communications, Sensing and Instrumentation, Aerospace and Defense, Wireless, RF Communications, Sensing& Instrumentation, Communication and Networking, Wireless, Milcom, Communications& Networking |
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Compliant with standards/RoHS standards: | RoHS Compliant |
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Compliant with standards/lead standards: | Lead Free |
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Compliant with the REACH SVHC standard: |
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