Encapsulation parameters/installation method: | Through Hole |
|
Physical parameters/medium materials: | Tantalum |
|
Other/Product Lifecycle: | Active |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
KEMET Corporation | 完全替代 |
Cap Tant Solid 6.8uF 35V 10% (4.7 X 12.04mm) Axial (0.001%FR) 125℃
|
|||
|
|
VISHAY | 完全替代 | Axial |
Cap Tant Solid 6.8uF 35V 10% (4.7 X 12.04mm) Axial (0.001%FR) 125℃
|
||
M39003/01-3024
|
Vishay Semiconductor | 完全替代 |
Cap Tant Solid 6.8uF 35V 10% (4.7 X 12.04mm) Axial (0.001%FR) 125℃
|
|||
M39003/01-6107
|
Vishay Semiconductor | 完全替代 | Through Hole |
Cap Tant Solid 6.8uF 35V 5% (4.7 X 12.04mm) Axial (0.1%FR) 125℃
|
||
M39003/01-6107
|
KEMET Corporation | 完全替代 |
Cap Tant Solid 6.8uF 35V 5% (4.7 X 12.04mm) Axial (0.1%FR) 125℃
|
|||
|
|
Vishay Sprague | 完全替代 | Through Hole |
Cap Tant Solid 6.8uF 35V 10% (4.7 X 12.04mm) Axial (0.001%FR) 125℃
|
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