Package parameters/number of pins: | 23 |
|
Encapsulation parameters/Encapsulation: | DBS23P |
|
Dimensions/Packaging: | DBS23P |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA8950J/N1,112
|
NXP | 功能相似 | SIP-23 |
TDA8950J 系列 2 X 150 W D类 功率放大器 HSOP-24
|
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