Encapsulation parameters/installation method: | Surface Mount |
|
Encapsulation parameters/Encapsulation: | SOIC-16 |
|
Dimensions/Packaging: | SOIC-16 |
|
Other/Product Lifecycle: | Unknown |
|
Other/Packaging Methods: | Tube |
|
Compliant with standards/RoHS standards: | RoHS Compliant |
|
Compliant with standards/lead standards: | Lead Free |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC509AU/1K
|
TI | 类似代替 | SOIC-16 |
16V、4:1 差分、单通道模拟多路复用器 16-SOIC -40 to 85
|
||
MPC509AUG4
|
Burr Brown | 类似代替 |
TEXAS INSTRUMENTS MPC509AUG4 芯片, 4通道差分模拟多路复用器
|
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