Technical parameters/frequency: | 20kHz ~ 250kHz |
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Technical parameters/number of output interfaces: | 1 |
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Technical parameters/output voltage: | 15.5 V |
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Technical parameters/output current: | 250 mA |
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Technical parameters/number of pins: | 8 |
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Technical parameters/dissipated power: | 660 mW |
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Technical parameters/switching frequency: | 250 kHz |
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Technical parameters/Input voltage (Max): | 308 VAC |
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Technical parameters/input voltage (Min): | 80 VAC |
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Technical parameters/output voltage (Max): | 17 V |
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Technical parameters/output voltage (Min): | 14 V |
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Technical parameters/output current (Max): | 250 mA |
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Technical parameters/operating temperature (Max): | 125 ℃ |
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Technical parameters/operating temperature (Min): | -40 ℃ |
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Technical parameters/dissipated power (Max): | 660 mW |
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Technical parameters/power supply voltage: | 9V ~ 20V |
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Technical parameters/power supply voltage (Max): | 20 V |
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Technical parameters/power supply voltage (Min): | 9 V |
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Technical parameters/input voltage: | 20 V |
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Encapsulation parameters/installation method: | Surface Mount |
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Package parameters/number of pins: | 8 |
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Encapsulation parameters/Encapsulation: | SOIC-8 |
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Dimensions/Length: | 5 mm |
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Dimensions/Width: | 4 mm |
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Dimensions/Height: | 1.75 mm |
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Dimensions/Packaging: | SOIC-8 |
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Physical parameters/operating temperature: | -40℃ ~ 125℃ |
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Other/Product Lifecycle: | Active |
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Other/Packaging Methods: | Tape & Reel (TR) |
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Other/Manufacturing Applications: Alternative material
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