Technical parameters/minimum current amplification factor (hFE): | 100 |
|
Technical parameters/operating temperature (Max): | 150 ℃ |
|
Technical parameters/operating temperature (Min): | -65 ℃ |
|
Technical parameters/dissipated power (Max): | 1.3 W |
|
Encapsulation parameters/installation method: | Surface Mount |
|
Package parameters/number of pins: | 4 |
|
Encapsulation parameters/Encapsulation: | UPAK |
|
Dimensions/Length: | 4.6 mm |
|
Dimensions/Width: | 2.6 mm |
|
Dimensions/Height: | 1.6 mm |
|
Dimensions/Packaging: | UPAK |
|
Other/Product Lifecycle: | Active |
|
Compliant with standards/RoHS standards: |
|
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BCX51-16,115
|
NXP | 功能相似 | SOT-89-3 |
NXP BCX51-16,115 单晶体管 双极, PNP, -45 V, 145 MHz, 500 mW, -1 A, 100 hFE
|
||
BCX52-16
|
Nexperia | 功能相似 | UPAK |
MULTICOMP BCX52-16 单晶体管 双极, PNP, -60 V, 125 MHz, 500 mW, -1 A, 250 hFE
|
||
BCX52-16
|
NXP | 功能相似 | SOT-89 |
MULTICOMP BCX52-16 单晶体管 双极, PNP, -60 V, 125 MHz, 500 mW, -1 A, 250 hFE
|
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